Diamond Anycut series is the fully new wire sawing machine combined with "single & multi " wire machine experience in the successful development of the self-made equipment and actual process applications to meet the customer cutting, cropping, front and end truncation of mono/polycrystalline silicon and sapphire ingots with the any kinds of workpiece size.
By matching this equipment with MDWEC diamond-coated saw wire that can fully enhance your dual completion accuracy and efficient capacity demand.
Diamond Anycut Application：
Able To Truncate Large, Irregularly –Shaped, Hard And Brittle Materials Such As Silicon Crystal, Quartz, Ceramics, Sapphire, Glass, Gallium Arsenide, And So On.
Feature
> With The State Monitoring System, To Master Information And Display The Machine Operation Condition.
> Customers Can According To The Size Of The Work Piece Optional Cutting Table.
> Direction Of Wire Travel Reciprocally
> High Wire-speed Design With Adjustable Parameters
> Optional Module Of The Sawing Parameters
> PLC Program Control
• High Quality - Excellent Finished Surface And Thickness Control.
• High Speed - Matching Mdwec Diamond-coated Wire Up With This Single Wire Saw Machine (Μsws-series) Means Shorten Cutting Time By 50%.
• High Compatibility - Available For Slicing Brittle & Hard Material, A Common Working-platform Design.
• High Efficiency - Low Kerf-loss, Reduce Lapping & Polishing Time (Next Stage).
• High Humanization - Has An User-friendly Computer-interfaced System , Easy To Operate And Maintain, Long Consumable Life，simple Consumable Replacement, And Easy To Acquire Spare Parts.
Specification：
Item(Model No.) | uSWS-1600K |
Workpiece Dimension | Max. 500(H)X 500(W)X 300(D)mm |
Wire Running Speed | Max. 600 m/min |
Wire Guide | Ø170 mm |
Number of Wire Guides | 5 sets |
Rocking degree | 0~+/-7 |
Z Table Stroke | 600mm |
Z In Feed Rate | 0.01~150mm/min |
Wire Diameter | Ø0.15~0.35 mm |
Wire Tension | Max. 40N or Less |
Volume of The Tank | 200L |
Installation Dimension | 2300(H) X 2000(W) X 2300(D) |
